点击图片查看原图
|
板材 |
FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, metal based |
|||
|
层数 |
1-16 |
|||
|
完成板厚 |
0.2 mm-3.8mm (8 mil-150 mil) |
|||
|
板厚 |
±10% |
|||
|
铜厚 |
0.5 OZ-6OZ (18 um-210 um) |
|||
|
过铜孔尺寸 |
18-40 um |
|||
|
抗阻公差 |
±10% |
|||
|
翘曲度 |
0.70% |
|||
|
可剥性 |
0.012"(0.3mm)-0.02 (0.5mm) |
|||
|
线路 |
||||
|
最小线宽 (a) |
0.075mm (3mil) |
|||
|
最小线距 (b) |
0.1mm (4 mil) |
|||
|
最小孔 |
0.1mm (4 mil) |
|||
|
贴片螺孔 (a) |
0.2 mm(8 mil) |
|||
|
BGA 孔(b) |
0.2 mm (8 mil) |
|||
|
0.05mm |
||||
|
阻焊 |
||||
|
最小阻焊桥宽 (a) |
0.0635 mm (2.5mil) |
|||
|
阻焊公差 (b) |
0.1mm (4 mil) |
|||
|
最小SMT盘间距 (c) |
0.1mm (4 mil) |
|||
|
阻焊厚度 |
0.0007"(0.018mm) |
|||
|
孔 |
||||
|
最小孔 (CNC) |
0.2 mm (8 mil) |
|||
|
最小钻孔 |
0.9 mm (35 mil) |
|||
|
孔公差 (+/-) |
PTH:±0.075mm;NPTH: ±0.05mm |
|||
|
空位公差 |
±0.075mm |
|||
|
表面处理 |
||||
|
有铅喷锡 |
2.5um |
|||
|
无铅喷锡 |
2.5um |
|||
|
沉金 |
镍 3-7um Au:1-5u'' |
|||
|
抗氧化 |
0.2-0.5um |
|||
|
外形 |
||||
|
拼版外形公差l (+/-) |
CNC: ±0.125mm, Punching: ±0.15mm |
|||
|
斜度 |
30°45° |
|||
|
金手指脚 |
15° 30° 45° 60° |
|||
|
证书 |
ROHS, ISO9001, CE, UL certificate. |
|||
